Siemens and TSMC advance AI driven semiconductor design automation through joint innovation
October 9, 2026 · 2 min read
Siemens Digital Industries Software and its EDA division announced on October 7 2026 a deepened partnership with TSMC to enhance AI powered automation and advanced semiconductor design support across the entire design flow.
The collaboration builds on a long standing relationship within TSMC Open Innovation Platform ecosystem to expand design assistance throughout semiconductor design workflows.
This partnership introduces an AI agent that automates design rule check error correction using Calibre software integrated with Aprisa and Solido software.
The agent reduces manual engineering effort improves workflow efficiency and shortens tapeout time for customers.
Ankur Gupta senior vice president of EDA IC software at Siemens Digital Industries Software stated that the continued cooperation with TSMC exemplifies Siemens commitment to providing AI driven automation and advanced semiconductor design capabilities for cutting edge process nodes.
Aveek Sarkar director of ecosystem and alliance management at TSMC highlighted that AI offers significant opportunities to improve productivity and efficiency in increasingly complex semiconductor design workflows.
The AI agentic workflow enables autonomous execution verification and improvement across multiple EDA tools.
Fuse EDA AI Agent incorporates NVIDIA AI technology to enhance token efficiency and improve reasoning and execution performance for long running engineering tasks.
A key innovation is the AI based DRC error correction workflow that intelligently identifies and resolves design rule violations using Calibre Check Assist and Solido Fuse technologies.
The workflow also expands to agentic place and route and digital implementation using Aprisa software.
Siemens and TSMC continue to support advanced 3D IC design with TSMC 3DFabric technology including Calibre 3DStack Advanced multi machine support for chiplet antenna verification.
Certification efforts include interface check flow performance improvements for TSMC SoW and support for TSMC COUPE reference flow.
Solido Simulation Suite Calibre xACT and Calibre 3DThermal software support silicon photonics applications and advanced packaging collaborations.
Calibre nmDRC Calibre nmLVS Calibre xACT and Calibre PERC have been certified for TSMC A14 process node.
Solido Simulation Suite is certified for TSMC N3C A16 and A14 process technologies for SPICE accuracy in analog RF and memory verification.
mPower software is certified for TSMC N2P and N3C process transistor level IR EM analysis.
Siemens Xcelerator Academy provides self paced on demand learning resources for Siemens EDA portfolio.
The program now serves TSMC Design Center Alliance partners as well as joint customers.
Siemens recently released an end to end digital implementation flow tutorial based on TSMC 5nm process technology.
These initiatives aim to improve design productivity reduce cycle time and support increasingly complex semiconductor design environments.